Monday, 27 February 2012

 Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. Th with 5 micron placement accuracy is valued at $100,000.
n conjunction with the company’s 20th anniversary this year, Finetech is celebrating the university R&D segment of its business. With a wide installed base of systems at some of the most prestigious institutions, FINEPLACER die bonders provide an ideal solution with precision and repeatability in a platform that is perfect for advanced technology environments utilizing diverse applications.
The FINEPLACER Pico MA is an “all-in-one” modular platform for advanced packaging and assembly applications — such as flip chip, optoelectronics, 3-D, wafer-level integration, micro-optics assembly, sensor packaging and precise die bonding.
For more information or to register for the drawing, visit http://www.finetechusa.com/bonders/products/promotion.html.
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